Influence of Various Factors on Lift-off Phenomenon in Wave Soldering with Sn-Bi Alloy.
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چکیده
منابع مشابه
EXPERIMNTAL STUDY ON Sn-Bi-In MELT-SPUN RIBBONS FOR INTERMEDIATE-STEP SOLDERING
we chose Sn10Bi, Sn10Bi10In, Sn20Bi, and Sn20Bi20In (numbers are in weight percent) rapidly solidified from melt using melt-spinning technique for intermediate –step soldering. We then investigated the structure, electrical and mechanical properties of the melt-spun ribbons using x-ray diffraction, double bridge circuit, dynamic resonance technique, and Vickers microhardeness tester. It was con...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 1999
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.2.116